A team of theoretical physicists at the U.S. Naval Research
Laboratory (NRL) and Boston College has identified cubic boron arsenide as a
material with an extraordinarily high thermal conductivity and the potential to
transfer heat more effectively from electronic devices than diamond, the
best-known thermal conductor to date.
As microelectronic devices become smaller, faster, and more
powerful, thermal management is becoming a critical challenge. This work
provides new insight into the nature of thermal transport at a quantitative
level and predicts a new material, with ultra-high thermal conductivity, of
potential interest for passive cooling applications. - See more at:
http://www.nrl.navy.mil/media/news-releases/2013/nrl-researchers-discover-novel-material-for-cooling-of-electronic-devices#sthash.etbX7AAk.dpuf