June 12, 2014

Researchers Design Circuits Capable of Functioning at Temperatures Greater than 650 Degrees Fahrenheit

The silicon-carbide wafer contains more 1000 individual circuits.

Engineering researchers at the University of Arkansas have designed integrated circuits that can survive at temperatures greater than 350 degrees Celsius – or roughly 660 degrees Fahrenheit. Their work, funded by the National Science Foundation, will improve the functioning of processors, drivers, controllers and other analog and digital circuits used in power electronics, automobiles and aerospace equipment – all of which must perform at high and often extreme temperatures.