The silicon-carbide wafer contains more 1000 individual
circuits.
Engineering researchers at the University of Arkansas have
designed integrated circuits that can survive at temperatures greater than 350
degrees Celsius – or roughly 660 degrees Fahrenheit. Their work, funded by the
National Science Foundation, will improve the functioning of processors,
drivers, controllers and other analog and digital circuits used in power
electronics, automobiles and aerospace equipment – all of which must perform at
high and often extreme temperatures.