U of T Engineering researchers, working with colleagues from
Carnegie Mellon University, have published new insights into how materials
transfer heat, which could eventually lead to smaller, more powerful electronic
devices.
Integrated circuits and other electronic parts have been
shrinking in size and growing in complexity and power for decades. But as
circuits get smaller, it becomes more difficult to dissipate waste heat. For
further advances to be made in electronics, researchers and industry need to find
ways of tracking heat transfer in products ranging from smartphones to
computers to solar cells.