(July 10, 2015) Researchers at Chalmers University of Technology have developed a method for efficiently cooling electronics using graphene-based film. The film has a thermal conductivity capacity that is four times that of copper. Moreover, the graphene film is attachable to electronic components made of silicon, which favours the film’s performance compared to typical graphene characteristics shown in previous, similar experiments.
Electronic systems available today accumulate a great deal of heat, mostly due to the ever-increasing demand on functionality. Getting rid of excess heat in efficient ways is imperative to prolonging electronic lifespan, and would also lead to a considerable reduction in energy usage. According to an American study, approximately half the energy required to run computer servers, is used for cooling purposes alone.
A couple of years ago, a research team led by Johan Liu, professor at Chalmers University of Technology, were the first to show that graphene can have a cooling effect on silicon-based electronics. That was the starting point for researchers conducting research on the cooling of silicon-based electronics using graphene.
“But the methods that have been in place so far have presented the researchers with problems”, Johan Liu says. “It has become evident that those methods cannot be used to rid electronic devices off great amounts of heat, because they have consisted only of a few layers of thermal conductive atoms. When you try to add more layers of graphene, another problem arises, a problem with adhesiveness. After having increased the amount of layers, the graphene no longer will adhere to the surface, since the adhesion is held together only by weak van der Waals bonds."